ACM Research (ACMR) Launches New Ultra ECDP Electrochemical Deplating Tool

ACM Research, Inc. (NASDAQ:ACMR) is one of the 14 Small Publicly Traded Semiconductor Companies to Invest in Now. On September 17, ACM Research, Inc. (NASDAQ:ACMR) introduced its first Ultra ECDP Electrochemical Deplating tool, which is specifically designed for wide bandgap compound semiconductor manufacturing.

The Ultra ECDP tool is designed for electrochemical wafer-level gold (Au) etching performed outside of the wafer pattern area. According to the report by ACM Research, Inc. (NASDAQ:ACMR), the tool offers a smaller undercut and enhanced uniformity and gold line appearance.

The new tool delivers specialized processes like removing Au bumps, etching thin Au films, and deep-hole Au deplating. The Ultra ECDP tool has integrated pre-wet and cleaning chambers. With precise chemistry circulation and advanced multi-anode electrochemical deplating technology, it reduces side etching, improves surface finish, and keeps excellent uniformity across all parts.

Dr. David Wang, ACM Research, Inc.’s (NASDAQ:ACMR) President and CEO, noted that the compound semiconductor market is growing because of strong demand from electric vehicles, 5G/6G communication, RF and AI applications, and more.

The Ultra ECDP tool has a modular design, offering flexibility to combine plating and deplating on the same platform. It uses multi-anode technology to control deplating in different areas and also offers full-face horizontal deplating to avoid cross-contamination at the time of processing.

ACM Research, Inc. (NASDAQ:ACMR) develops, manufactures, and sells semiconductor process equipment including cleaning, electroplating, stress-free polishing, vertical furnace processes, track, PECVD, and wafer- and panel-level packaging tools. The company’s products support advanced and semi-critical semiconductor device manufacturing.

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Disclosure: None. This article is originally published at Insider Monkey.