Valens Semiconductor and onsemi Partner to Develop Integrated 3MP Automotive Camera Sensor

Valens Semiconductor (NYSE:VLN) has entered into a collaboration agreement with onsemi (NASDAQ:ON) to develop a cost-optimised image sensor incorporating MIPI A-PHY connectivity for high-volume automotive camera applications.

The agreement, announced on 22 September 2026, focuses on integrating Valens’ connectivity technology directly into onsemi’s image sensors, targeting the 3-megapixel (3MP) segment.

The companies aim to provide automotive manufacturers and Tier 1 suppliers with an integrated solution that supports adoption of the MIPI A-PHY standard.

Collaboration Targets Simplified Automotive Camera Design

Under the agreement, Valens will work with onsemi to incorporate MIPI A-PHY connectivity into the image sensor itself.

The integrated approach is intended to reduce the number of separate components required in automotive camera systems while supporting industry-standard connectivity.

Ahmed Salem, Vice President and General Manager of the Intelligent Sensing Group at onsemi, said the collaboration aims to enable:

“a more streamlined camera architecture that reduces component count, supports industry standards, and ultimately makes advanced vision systems easier to deploy.”

The companies are targeting applications where manufacturers require cost-efficient camera systems that can be produced in high volumes.

Companies Focus on 3MP Automotive Camera Market

Most automotive image sensors currently target resolutions between 1 and 3 megapixels, according to the companies.

Valens and onsemi said their planned 3MP offering addresses this established market while also targeting demand from automotive manufacturers upgrading to higher-resolution camera systems.

The collaboration is intended to provide an additional route for original equipment manufacturers (OEMs) and Tier 1 suppliers to incorporate MIPI A-PHY connectivity into their camera designs.

MIPI A-PHY is an industry standard designed for high-speed sensor connectivity in automotive applications.

Partnership Expands Valens’ A-PHY Product Offering

Valens has previously announced design wins with multiple automotive OEMs for its VA7000 MIPI A-PHY chipsets.

The collaboration with onsemi extends its approach to include connectivity integrated directly into image sensors, complementing its existing standalone chipset products.

Yoram Salinger, Chief Executive of Valens Semiconductor, said the new offering:

“complements Valens’ existing solutions, bringing A-PHY to a much broader range of use cases.”

He added that working with onsemi strengthens the technology ecosystem by giving:

“automakers the supplier choice they expect from an industry standard.”

The agreement establishes a development partnership between the two semiconductor companies. Neither a commercial launch date nor financial terms were disclosed in the announcement.

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