Lam Research Unveils VECTOR TEOS 3D

Lam Research Corporation (NASDAQ:LRCX) is among the 11 Best Semiconductor Stocks with Huge Upside Potential. Lam Research Corporation (NASDAQ:LRCX) unveiled VECTOR® TEOS 3D, an entirely new deposition method designed to address complex packaging issues in the manufacturing of AI and high-performance computing chips. The system uses Lam Equipment Intelligence® technology and a unique bowed wafer handling technique to produce ultra-thick, void-free inter-die gapfill films up to 60 microns, with scalability beyond 100 microns. It allows single-pass deposition of crack-free films larger than 30 microns, considerably increasing yield. The quad station module architecture boosts throughput by approximately 70% while reducing the total cost of ownership by up to 20%.

Chipmakers are moving toward 3D stacking and chiplet architectures in an effort to further improve performance and space utilization due to the spike in demand for AI. These methods reduce yield by causing issues like wafer bow and film cracking. Lam Research Corporation (NASDAQ:LRCX)’s TEOS 3D tackles these difficulties with nanoscale precision, improved stability for thick wafers, and energy-efficient RF generators, allowing consistent production and enabling scalability beyond Moore’s Law. It is among the Stocks with Biggest Upside.

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