On May 20, Taiwanese chip designer, MediaTek announced plans to start the tape-out process for its 2-nanometer chip at Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) in September 2025.
MediaTek CEO Rick Tsai shared the news at the Computex forum in Taipei. This step reinforces TSMC’s role as the world’s leading contract chipmaker, strengthening its collaboration with MediaTek.
MediaTek’s next-generation 2nm chip is tailored for high-end smartphones. The taping out at Taiwan Semiconductor Manufacturing Company Limited would mark a significant milestone and transition from the popular 3nm smartphone SoCs.
While Apple has always been the first to adopt new nodes, MediaTek is looking to usurp it by getting the first 2nm smartphone SoC while using Taiwan Semiconductor’s foundry services. MediaTek joins a growing list of companies, including Apple, Qualcomm, and AMD, that have tapped TSM foundry services.
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Disclosure: None.