Last Close
Apr 08  •  04:00PM ET
24.14
Dollar change
+1.95
Percentage change
8.79
%
Apr 08, 7:31 AMASE Technology's filing of its 2025 Form 20-F annual report with the SEC catalyzed an ~8% premarket surge.
Index
-
P/E
41.71
EPS (ttm)
0.58
Insider Own
0.00%
Shs Outstand
2.19B
Perf Week
11.35%
Market Cap
52.80B
Forward P/E
18.69
EPS next Y
1.29
Insider Trans
-
Shs Float
2.19B
Perf Month
11.45%
Enterprise Value
58.84B
PEG
0.39
EPS next Q
0.17
Inst Own
7.41%
Perf Quarter
37.94%
Income
1.31B
P/S
2.54
EPS this Y
63.77%
Inst Trans
2.68%
Perf Half Y
111.94%
Sales
20.75B
P/B
4.77
EPS next Y
40.54%
ROA
5.15%
Perf YTD
49.94%
Book/sh
5.06
P/C
16.55
EPS next 5Y
48.46%
ROE
12.54%
52W High
25.28 -4.53%
Perf Year
225.34%
Cash/sh
1.46
P/FCF
-
EPS past 3/5Y
-14.87% 6.47%
ROIC
7.24%
52W Low
6.94 247.84%
Perf 3Y
209.88%
EV/EBITDA
15.51
Sales past 3/5Y
-2.73% 5.04%
Gross Margin
16.78%
Volatility
2.60% 3.33%
Perf 5Y
202.89%
EV/Sales
2.84
EPS Y/Y TTM
29.14%
Oper. Margin
8.00%
ATR (14)
0.98
Perf 10Y
352.14%
Quick Ratio
1.00
Sales Y/Y TTM
11.98%
Profit Margin
6.32%
RSI (14)
64.13
Current Ratio
1.28
EPS Q/Q
60.19%
SMA20
10.39%
Beta
1.48
Debt/Eq
0.76
Sales Q/Q
14.24%
SMA50
9.56%
Rel Volume
1.12
Prev Close
22.19
Employees
-
LT Debt/Eq
0.64
SMA200
58.88%
Avg Volume
7.81M
Price
24.14
IPO
Apr 18, 2018
Option/Short
Yes / Yes
Trades
Volume
8,716,898
Change
8.79%
Date Action Analyst Rating Change Price Target Change
Oct-30-25Upgrade Nomura Neutral → Buy
Oct-15-24Upgrade UBS Neutral → Buy
Sep-16-24Upgrade Morgan Stanley Equal-Weight → Overweight
Jun-25-24Downgrade Morgan Stanley Overweight → Equal-Weight
Jul-28-23Upgrade Goldman Neutral → Buy $6.60 → $9.20
Jun-28-23Downgrade HSBC Securities Buy → Hold $6.47
Feb-10-23Downgrade China Renaissance Buy → Hold
Oct-07-21Downgrade Goldman Buy → Neutral $13.30 → $8.10
Jun-25-21Downgrade Nomura Buy → Neutral
Sep-24-19Downgrade Morgan Stanley Overweight → Equal-Weight
Apr-08-26 04:00AM
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ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. It develops and offers complete turnkey solutions in IC (Integrated Circuit) packaging, design and production of interconnect materials, front-end engineering testing, wafer probing and final testing, as well as electronic manufacturing services. The company was founded on April 30, 2018 and is headquartered in Kaohsiung City, Taiwan.