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Last Close
Dec 13 04:00PM ET
10.16
Dollar change
+0.29
Percentage change
2.94
%
Index- P/E22.19 EPS (ttm)0.46 Insider Own0.00% Shs Outstand2.17B Perf Week-0.29%
Market Cap22.04B Forward P/E15.14 EPS next Y0.67 Insider Trans- Shs Float2.17B Perf Month5.50%
Income1.02B PEG0.72 EPS next Q0.13 Inst Own7.46% Short Float0.50% Perf Quarter3.78%
Sales18.55B P/S1.19 EPS this Y0.47% Inst Trans-3.62% Short Ratio1.61 Perf Half Y-10.01%
Book/sh4.51 P/B2.25 EPS next Y45.78% ROA4.58% Short Interest10.78M Perf Year12.89%
Cash/sh1.13 P/C9.03 EPS next 5Y30.89% ROE10.72% 52W Range8.10 - 12.86 Perf YTD7.97%
Dividend Est.0.32 (3.12%) P/FCF16.27 EPS past 5Y3.72% ROI7.28% 52W High-21.00% Beta1.22
Dividend TTM0.32 (3.11%) Quick Ratio0.89 Sales past 5Y9.80% Gross Margin15.31% 52W Low25.43% ATR (14)0.27
Dividend Ex-DateJul 02, 2024 Current Ratio1.18 EPS Y/Y TTM-17.32% Oper. Margin6.89% RSI (14)55.53 Volatility2.17% 2.08%
Employees92894 Debt/Eq0.65 Sales Y/Y TTM-3.68% Profit Margin5.47% Recom1.85 Target Price9.10
Option/ShortYes / Yes LT Debt/Eq0.43 EPS Q/Q6.33% Payout48.49% Rel Volume1.62 Prev Close9.87
Sales Surprise2.87% EPS Surprise5.04% Sales Q/Q1.85% EarningsOct 31 BMO Avg Volume6.71M Price10.16
SMA202.86% SMA502.26% SMA200-2.19% Trades Volume10,863,359 Change2.94%
Date Action Analyst Rating Change Price Target Change
Oct-15-24Upgrade UBS Neutral → Buy
Sep-16-24Upgrade Morgan Stanley Equal-Weight → Overweight
Jun-25-24Downgrade Morgan Stanley Overweight → Equal-Weight
Jul-28-23Upgrade Goldman Neutral → Buy $6.60 → $9.20
Jun-28-23Downgrade HSBC Securities Buy → Hold $6.47
Feb-10-23Downgrade China Renaissance Buy → Hold
Oct-07-21Downgrade Goldman Buy → Neutral $13.30 → $8.10
Jun-25-21Downgrade Nomura Buy → Neutral
Sep-24-19Downgrade Morgan Stanley Overweight → Equal-Weight
Sep-04-19Initiated Goldman Buy
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ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services. It develops and offers complete turnkey solutions in IC (Integrated Circuit) packaging, design and production of interconnect materials, front-end engineering testing, wafer probing and final testing, as well as electronic manufacturing services. The company was founded on April 30, 2018 and is headquartered in Kaohsiung City, Taiwan.