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ASE Technology Holding Co., Ltd.
Index- P/E19.18 EPS (ttm)0.40 Insider Own- Shs Outstand2.13B Perf Week14.14%
Market Cap16.56B Forward P/E21.42 EPS next Y0.36 Insider Trans- Shs Float1.58B Perf Month34.80%
Income855.20M PEG0.56 EPS next Q0.08 Inst Own4.40% Short Float0.06% Perf Quarter80.90%
Sales15.87B P/S1.04 EPS this Y-33.50% Inst Trans0.04% Short Ratio0.81 Perf Half Y62.85%
Book/sh3.44 P/B2.23 EPS next Y11.88% ROA4.20% Target Price6.43 Perf Year46.37%
Cash/sh1.02 P/C7.54 EPS next 5Y34.20% ROE11.80% 52W Range3.17 - 7.68 Perf YTD31.34%
Dividend0.14 P/FCF5.93 EPS past 5Y- ROI4.20% 52W High-0.07% Beta-
Dividend %1.83% Quick Ratio1.00 Sales past 5Y- Gross Margin16.80% 52W Low141.96% ATR0.27
Employees97259 Current Ratio1.30 Sales Q/Q4.80% Oper. Margin7.00% RSI (14)77.11 Volatility3.74% 2.57%
OptionableNo Debt/Eq1.04 EPS Q/Q16.50% Profit Margin5.40% Rel Volume2.38 Prev Close7.11
ShortableYes LT Debt/Eq0.82 Earnings- Payout996.80% Avg Volume1.25M Price7.67
Recom1.50 SMA2023.58% SMA5035.73% SMA20063.69% Volume2,969,380 Change7.88%
Sep-24-19Downgrade Morgan Stanley Overweight → Equal-Weight
Sep-04-19Initiated Goldman Buy
Aug-01-19Upgrade Macquarie Underperform → Outperform
May-14-19Reiterated Cowen Market Perform $31 → $30
Jan-02-19Downgrade Macquarie Neutral → Underperform
Oct-10-18Downgrade JP Morgan Overweight → Neutral
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ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA), flip chip chip scale package (CSP), advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions, as well as module-based solutions. It also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer level packaging; SESUB; and substrate interposer packages. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, warehousing management, logistics, and after sales services; manufactures computer assistance systems and related peripherals, electronic components, communication peripherals, telecommunications equipment, motherboards, and car components; imports and exports various products and technology. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.