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TTM Technologies, Inc., together with its subsidiaries, engages in the manufacture and sale engineered systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB) worldwide. The company operates in two segments, PCB and RF&S Components. It offers range of engineered systems, RF and microwave assemblies, HDI PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration, IC substrates, passive RF components, advanced ceramic RF components, hi-reliability multi-chip modules, beamforming and switching networks, PCB products, RF components, and backplane/custom assembly solutions, including conventional PCBs. In addition, the company provides radar systems including maritime surveillance and weather avoidance radar systems, surveillance products, communication systems, radio-frequency assembly and test services, and passive RF components. It also offers advanced ceramic RF components including standard and etched thick-film ceramic substrates; hi-reliability multi-chip modules. Further, the company provides custom designed application specific integrated circuits, conventional PCBs, such as single-sided, double-sided, and multi-layer boards; high density interconnect, IC substrates, flexible and rigid flex PCBs, and custom assemblies including backplane and mid-plane assemblies, flexible and rigid-flex assemblies, and RF assemblies. Additionally, it offers quick turnaround services, which includes prototype production and ramp-to-volume production, and thermal management. The company serves original equipment manufacturers and electronic manufacturing services providers, original design manufacturers, distributors, and government agencies; and aerospace and defense, data center computing, automotive, medical, industrial, and instrumentation, as well as networking and telecommunications applications. TTM Technologies, Inc. was incorporated in 1978 and is headquartered in Santa Ana, California. |
Insider Trading |
Relationship |
Date |
Transaction |
Cost |
#Shares |
Value ($) |
#Shares Total |
SEC Form 4 |
Powers Shawn A. | EVP, Human Resources | Aug 22 | Sale | 14.95 | 10,000 | 149,500 | 85,807 | Aug 23 09:41 AM | Knecht Dale Martin | SVP Information Technology | Aug 08 | Sale | 15.09 | 20,000 | 301,724 | 90,684 | Aug 08 05:08 PM | Weber Daniel J | EVP, General Counsel | Aug 07 | Sale | 14.91 | 16,000 | 238,512 | 92,598 | Aug 08 04:33 PM | Gridley Catherine A | EVP, A&D BU President | Aug 07 | Sale | 14.91 | 10,000 | 149,094 | 106,072 | Aug 08 04:28 PM | Powers Shawn A. | EVP, Human Resources | Aug 07 | Sale | 14.90 | 8,000 | 119,217 | 95,807 | Aug 08 04:30 PM | Farrell Robert P. | President C&C | Aug 07 | Sale | 14.95 | 4,032 | 60,265 | 21,699 | Aug 08 04:26 PM | SANCHEZ TONY | VP, Corporate Controller | Jun 23 | Sale | 13.43 | 7,131 | 95,740 | 23,256 | Jun 26 09:29 PM | Weber Daniel J | EVP, General Counsel | Mar 01 | Sale | 13.51 | 8,600 | 116,216 | 92,089 | Mar 02 08:04 AM |
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