ASX [NYSE]
ASE Technology Holding Co., Ltd.
Index- P/E5.09 EPS (ttm)1.07 Insider Own- Shs Outstand2.16B Perf Week6.02%
Market Cap11.87B Forward P/E6.20 EPS next Y0.88 Insider Trans- Shs Float2.14B Perf Month-0.55%
Income2.34B PEG0.15 EPS next Q0.23 Inst Own6.70% Short Float0.37% Perf Quarter6.85%
Sales19.84B P/S0.60 EPS this Y127.50% Inst Trans-1.38% Short Ratio1.13 Perf Half Y-21.44%
Book/sh3.84 P/B1.42 EPS next Y-2.76% ROA10.80% Target Price7.20 Perf Year-25.51%
Cash/sh1.10 P/C4.95 EPS next 5Y34.20% ROE29.40% 52W Range4.88 - 8.15 Perf YTD-30.09%
Dividend0.47 P/FCF4.19 EPS past 5Y62.75% ROI13.70% 52W High-33.01% Beta1.18
Dividend %8.55% Quick Ratio0.80 Sales past 5Y- Gross Margin20.10% 52W Low11.89% ATR0.18
Employees97800 Current Ratio1.20 Sales Q/Q26.40% Oper. Margin14.60% RSI (14)50.63 Volatility3.47% 2.85%
OptionableYes Debt/Eq0.79 EPS Q/Q54.20% Profit Margin11.80% Rel Volume1.30 Prev Close5.43
ShortableYes LT Debt/Eq0.53 EarningsJul 28 BMO Payout- Avg Volume6.99M Price5.46
Recom2.30 SMA201.22% SMA50-4.53% SMA200-16.98% Volume9,059,976 Change0.55%
Oct-07-21Downgrade Goldman Buy → Neutral $13.30 → $8.10
Jun-25-21Downgrade Nomura Buy → Neutral
Sep-24-19Downgrade Morgan Stanley Overweight → Equal-Weight
Sep-04-19Initiated Goldman Buy
Aug-01-19Upgrade Macquarie Underperform → Outperform
May-14-19Reiterated Cowen Market Perform $31 → $30
Jan-02-19Downgrade Macquarie Neutral → Underperform
Oct-10-18Downgrade JP Morgan Overweight → Neutral
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ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.