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ASE Technology Holding Co., Ltd.
Index- P/E17.73 EPS (ttm)0.46 Insider Own- Shs Outstand2.14B Perf Week-1.44%
Market Cap18.28B Forward P/E17.13 EPS next Y0.48 Insider Trans- Shs Float1.60B Perf Month2.76%
Income990.60M PEG0.52 EPS next Q0.08 Inst Own4.50% Short Float0.52% Perf Quarter5.00%
Sales17.12B P/S1.07 EPS this Y62.80% Inst Trans0.57% Short Ratio2.66 Perf Half Y70.98%
Book/sh3.67 P/B2.23 EPS next Y38.15% ROA4.80% Target Price8.92 Perf Year84.88%
Cash/sh0.90 P/C9.06 EPS next 5Y34.20% ROE13.30% 52W Range3.88 - 9.00 Perf YTD40.24%
Dividend0.14 P/FCF6.80 EPS past 5Y- ROI6.80% 52W High-9.00% Beta-
Dividend %1.71% Quick Ratio0.90 Sales past 5Y- Gross Margin16.30% 52W Low111.08% ATR0.24
Employees101785 Current Ratio1.30 Sales Q/Q28.30% Oper. Margin7.30% RSI (14)54.28 Volatility1.91% 2.13%
OptionableNo Debt/Eq0.91 EPS Q/Q56.50% Profit Margin5.80% Rel Volume0.56 Prev Close7.83
ShortableYes LT Debt/Eq0.72 EarningsApr 28 BMO Payout0.00% Avg Volume3.16M Price8.19
Recom1.50 SMA201.97% SMA505.49% SMA20037.08% Volume1,780,185 Change4.60%
Sep-24-19Downgrade Morgan Stanley Overweight → Equal-Weight
Sep-04-19Initiated Goldman Buy
Aug-01-19Upgrade Macquarie Underperform → Outperform
May-14-19Reiterated Cowen Market Perform $31 → $30
Jan-02-19Downgrade Macquarie Neutral → Underperform
Oct-10-18Downgrade JP Morgan Overweight → Neutral
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ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA), flip chip chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions. It also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. ASE Technology Holding Co., Ltd. was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.